PRODUCTSProduct Information

Wafer Handling System:Aligner



Product Features

RA321-C0C-BW is the edge clamp type aligner which has the clamp axis, θ-axis, and Z-axis. The edge clamp method, which clamps the outer periphery of the wafer, minimizes the particles generation.

  • High speed and high accuracy (Notch accuracy: ±0.05°, Center accuracy: ±0.05mm)
  • Throughput of the system is improved (with buffer).
  • Handling of transparent (glass) and laminate wafers
     Notch-less wares can be handled using the image sensor optionally.

Main Specifications of the Product

Wafer size
Dia. 300mm
Notch angle accuracy
±0.05 to ±0.2° Changes according to the alignment mode.
Center accuracy
±0.05 to ±0.1mm Changes according to the alignment mode.
Positioning time interval
4 to 6.5sec Changes according to the type of the sensor and alignment mode.
Power supply
24V DC 4A
Communication method

Product Dimensions (Standard Specifications)

  • image

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