PRODUCTSProduct Information
Wafer Handling System:EFEM/SORTER
ACE EFEM
![image](/wp_rorze/wp-content/uploads/2016/12/main_ACE-EFEM.jpg)
Product Features
The high speed transferring system is realized by mounting the new type clean robot and high speed linear track axis. Connection with the OHT and AGV is available.
- Higher throughput can be attained by mounting two aligners.
- Corresponding to the vacuum chucking type and edge clamp type (option)
- Compatible use of 200mm and 300mm works (option)
Main Specifications of the Product
- Type
- RSC131
- Number of ports
- 2ports
- Transferring object
- 300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
- Carrier
- 25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
- Power voltage
- Single-phase 200V AC ±10%, 50/60Hz ±5%
- Current consumption
- 4kVA (20A/200V AC) Including FFU
- Vacuum (source pressure)
- -80kPa~-90kPa
- Vacuum (flow rate)
- 40L/min
- Positive pressure (source pressure)
- 0.6MPa~0.7MPa
- Positive pressure (flow rate)
- 20L/min
- EMO contact output
- 2systems (dry contact)
- Interlock
- Input: 8points/Output: 8points (insulated I/O)
- Type
- RSC141
- Number of ports
- 3ports
- Transferring object
- 300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
- Carrier
- 25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
- Power voltage
- Single-phase 200V AC ±10%, 50/60Hz ±5%
- Current consumption
- 4kVA (20A/200V AC) Including FFU
- Vacuum (source pressure)
- -80kPa~-90kPa
- Vacuum (flow rate)
- 50L/min
- Positive pressure (source pressure)
- 0.6MPa~0.7MPa
- Positive pressure (flow rate)
- 30L/min
- EMO contact output
- 2systems (dry contact)
- Interlock
- Input: 8points/Output: 8points (insulated I/O)
Product Dimensions (RSC141)
Option
- Automatic teaching system
- Ionizer
- Chemical filter
- Wafer internal buffer
- Bar code reader/RF-ID
- E84
- The load port with N2/XCDA purge
- Teaching pendant
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