PRODUCTSProduct Information

Wafer Handling System:EFEM/SORTER

ACE EFEM

image

Product Features

The high speed transferring system is realized by mounting the new type clean robot and high speed linear track axis. Connection with the OHT and AGV is available.

  • Higher throughput can be attained by mounting two aligners.
  • Corresponding to the vacuum chucking type and edge clamp type (option)
  • Compatible use of 200mm and 300mm works (option)

Main Specifications of the Product

Type
RSC131
Number of ports
2ports
Transferring object
300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
Carrier
25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
Power voltage
Single-phase 200V AC ±10%, 50/60Hz ±5%
Current consumption
4kVA (20A/200V AC) Including FFU
Vacuum (source pressure)
-80kPa~-90kPa
Vacuum (flow rate)
40L/min
Positive pressure (source pressure)
0.6MPa~0.7MPa
Positive pressure (flow rate)
20L/min
EMO contact output
2systems (dry contact)
Interlock
Input: 8points/Output: 8points (insulated I/O)
Type
RSC141
Number of ports
3ports
Transferring object
300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
Carrier
25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
Power voltage
Single-phase 200V AC ±10%, 50/60Hz ±5%
Current consumption
4kVA (20A/200V AC) Including FFU
Vacuum (source pressure)
-80kPa~-90kPa
Vacuum (flow rate)
50L/min
Positive pressure (source pressure)
0.6MPa~0.7MPa
Positive pressure (flow rate)
30L/min
EMO contact output
2systems (dry contact)
Interlock
Input: 8points/Output: 8points (insulated I/O)

Product Dimensions (RSC141)

  • image

Option

  • Automatic teaching system
  • Ionizer
  • Chemical filter
  • Wafer internal buffer
  • RF-ID and bar code reader
  • E84
  • The load port with N2/XCDA purge
  • Teaching pendant

Materials

For inquiry on this product, please click on
this link

Page Top