PRODUCTSProduct Information
Wafer Handling System：EFEM/SORTER
ACE EFEM
Product Features
The high speed transferring system is realized by mounting the new type clean robot and high speed linear track axis. Connection with the OHT and AGV is available.
- Higher throughput can be attained by mounting two aligners.
- Corresponding to the vacuum chucking type and edge clamp type (option)
- Compatible use of 200mm and 300mm works (option)
Main Specifications of the Product
- Type
- RSC131
- Number of ports
- 2ports
- Transferring object
- 300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
- Carrier
- 25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
- Power voltage
- Single-phase 200V AC ±10%, 50/60Hz ±5%
- Current consumption
- 4kVA (20A/200V AC) Including FFU
- Vacuum (source pressure)
- -80kPa～-90kPa
- Vacuum (flow rate)
- 40L/min
- Positive pressure (source pressure)
- 0.6MPa～0.7MPa
- Positive pressure (flow rate)
- 20L/min
- EMO contact output
- 2systems (dry contact)
- Interlock
- Input: 8points/Output: 8points (insulated I/O)
- Type
- RSC141
- Number of ports
- 3ports
- Transferring object
- 300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
- Carrier
- 25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
- Power voltage
- Single-phase 200V AC ±10%, 50/60Hz ±5%
- Current consumption
- 4kVA (20A/200V AC) Including FFU
- Vacuum (source pressure)
- -80kPa～-90kPa
- Vacuum (flow rate)
- 50L/min
- Positive pressure (source pressure)
- 0.6MPa～0.7MPa
- Positive pressure (flow rate)
- 30L/min
- EMO contact output
- 2systems (dry contact)
- Interlock
- Input: 8points/Output: 8points (insulated I/O)
Product Dimensions (RSC141)
Option
- Automatic teaching system
- Ionizer
- Chemical filter
- Wafer internal buffer
- Bar code reader/RF-ID
- E84
- The load port with N2/XCDA purge
- Teaching pendant
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