Product Features

RA321-C0C-BW is the edge clamp type aligner which has the clamp axis, θ-axis, and Z-axis. The edge clamp method, which clamps the outer periphery of the wafer, minimizes the particles generation.

• High speed and high accuracy (Notch accuracy: ±0.05°, Center accuracy: ±0.05mm)
• Throughput of the system is improved (with buffer).
• Handling of transparent (glass) and laminate wafers
  　Notch-less wares can be handled using the image sensor optionally.

Main Specifications of the Product

Wafer size

Dia. 300mm

Notch angle accuracy

±0.05 to ±0.2°　Changes according to the alignment mode.

Center accuracy

±0.05 to ±0.1mm　Changes according to the alignment mode.

Positioning time interval

4 to 6.5sec　Changes according to the type of the sensor and alignment mode.

Power supply

24V DC 4A

Communication method

TCP/IP

Product Dimensions (Standard Specifications)

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