PRODUCTSProduct Information

Wafer Handling System:Vacuum Wafer Robot

RR481L230

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Product Features

The RR481/boomerang arm vacuum robot (double-arm) realizes the high positioning repeatability and highly reliable vacuum partition performance by adopting DDM (vacuum direct drive motor) for the drive section. The arm mechanism driven by steel belt realizes the adoption of long end-effector even with small rotation area.

  • Small rotation area.
  • Long end-effector available for long reach.
  • Available for narrow gate opening size (15mm).
  • High accuracy.
  • Available for ultrahigh vacuum.
  • High throughput.
  • Available for the AWC option (wafer position compensation).

Main Specifications of the Product

Substrate size
Up to 300mm wafer
Capacity
3.0kg/10 Nm, Note: For wrist attachment section (including end-effector)
Transfer distance of substrate center
835mm (for 300mm wafer)
Z-axis stroke
70mm/140mm
Rotation range
Rotation not limited
Rotation diameter
590mm
Transfer accuracy (X,Y)
±0.1mm
Mass
100kg
Vacuum-proof level
10E-6 Pa
He leakage rate
5x10E-9 Pa.㎥/sec He (Base vacuum 5x10E-4 Pa)
Operating temperature
80℃ or less
Materials used in vacuum
Alminum, Stainless steel, AM350 (Bellows), Magnet with Ni plating spec., Fluorine-based O-ring
Motor specifications
Vacuum direct drive motor (Z-axis: Servo motor)
Encoder specifications
ABS
Utility
48V DC (motor drive), 24V DC (communication)
Communication specifications
TCP/IP
Option
Teaching pendant, Power unit (200V AC input)

Product Dimensions (Standard Specifications)

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