PRODUCTSProduct Information

Wafer Handling System:Aligner



Product Features

RA320-C22-L is an aligner that has the Z-axis and X-axis mechanisms for compensating the wafer position in addition to the θ-axis. This is a small and lightweight type to reduce the installation footprint. Various kinds of the wafer alignment operations are available using the non-contact optical sensors with high performance, and the high-accuracy alignment is achieved.

  • Wafer to be handled: Silicon, transparent (glass), and laminate wafers
  • Small type and lightweight.
  • Small footprint.

Main Specifications of the Product

Wafer size
Dia. 300mm
Notch angle accuracy
±0.05 to ±0.2° Changes according to the alignment mode.
Center accuracy
±0.1mm Changes according to the alignment mode.
Positioning time interval
5 to 7sec Changes according to the alignment mode.
Power supply
24V DC 4A
Communication method
TCP/IP (RS-232C is also available as an option)

Product Dimensions (Standard Specifications)

  • image

For request materials and inquiry about our products, click on
this link

Page Top