Product Features

RA320-C22-L is an aligner that has the Z-axis and X-axis mechanisms for compensating the wafer position in addition to the θ-axis. This is a small and lightweight type to reduce the installation footprint. Various kinds of the wafer alignment operations are available using the non-contact optical sensors with high performance, and the high-accuracy alignment is achieved.

• Wafer to be handled: Silicon, transparent (glass), and laminate wafers
• Small type and lightweight.
• Small footprint.

Main Specifications of the Product

Wafer size

Dia. 300mm

Notch angle accuracy

±0.05 to ±0.2°　Changes according to the alignment mode.

Center accuracy

±0.1mm　Changes according to the alignment mode.

Positioning time interval

5 to 7sec　Changes according to the alignment mode.

Power supply

24V DC 4A

Communication method

TCP/IP （RS-232C is also available as an option）

Product Dimensions (Standard Specifications)

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