PRODUCTSProduct Information
Wafer Handling System：EFEM/SORTER
ACE SORTER
Product Features
High throughput sorting is realized by using the clean robot on which the new servo is mounted, aligner, and linear track axis. The frame has the configuration so that the load port can be mounted at the front, back, left, and right of the frame , and the load port and various units can be addd kater. Direct connection with the OHT and stocker is available.
- High speed alignment using two aligners
- The edge clamp method prevents transferring particles onto the back surface of a wafer.
- IDs on both surfaces of a wafer can be read.
- Corresponding to the system on which the OHT and stocker are mounted.
- Transferring wafers can be instructed on the touch panel to realize easy-to-understand operability.
Main Specifications of the Product
- Type
- RSC132
- Number of ports
- 2ports
- Transferring object
- 300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
- Carrier
- 25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
- Power voltage
- Single-phase 200V AC ±10%, 50/60Hz ±5%
- Current consumption
- 4kVA (20A/200V AC) Including FFU
- Vacuum (source pressure)
- -80kPa～-90kPa
- Vacuum (flow rate)
- 30L/min
- Positive pressure (source pressure)
- 0.6MPa～0.7MPa
- Positive pressure (flow rate)
- 20L/min
- Type
- RSC142
- Number of ports
- 3ports
- Transferring object
- 300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
- Carrier
- 25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
- Power voltage
- Single-phase 200V AC ±10%, 50/60Hz ±5%
- Current consumption
- 4kVA (20A/200V AC) Including FFU
- Vacuum (source pressure)
- -80kPa～-90kPa
- Vacuum (flow rate)
- 40L/min
- Positive pressure (source pressure)
- 0.6MPa～0.7MPa
- Positive pressure (flow rate)
- 30L/min
- Type
- RSC152
- Number of ports
- 4ports
- Transferring object
- 300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
- Carrier
- 25-slot 300mm FOUP (SEMI E47.1) 25-slot 300mm FOSB (SEMI M31)
- Power voltage
- Single-phase 200V AC ±10%, 50/60Hz ±5%
- Current consumption
- 4kVA (20A/200V AC) Including FFU
- Vacuum (source pressure)
- -80kPa～-90kPa
- Vacuum (flow rate)
- 50L/min
- Positive pressure (source pressure)
- 0.6MPa～0.7MPa
- Positive pressure (flow rate)
- 40L/min
Product Dimensions (RSC141)
Option
- Corresponding to various transferring operations such as reversing a wafer and open casette
- Glass wafers and laminate wafers
- Various chemical filters
- Bar code reader/RF-ID
- Compatible transferring of 200 mm and 300 mm works
- FOUP for the stocker-mounted type
- Ionizer
- N2/XCDA purge
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