PRODUCTSProduct Information

Wafer Handling System:Vacuum Wafer Robot

RR493L180

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Product Features

The RR493/scara arm vacuum robot (single arm) realizes the high positioning repeatability and highly reliable vacuum partition performance by adopting DDM (vacuum direct drive motor) for the drive section. The link-arm mechanism driven by steel belt realizes the adoption of long end-effector even with small rotation area.

  • Small rotation area (small footprint).
  • Long end-effector available for long reach.
  • Available for narrow gate opening size (15 mm).
  • High accuracy.
  • Available for ultrahigh vacuum.
  • High throughput.
  • Available for the AWC option (wafer position compensation).

Main Specifications of the Product

Substrate size
Up to 300mm wafer
Capacity
3.0kg/10 Nm, Note: For wrist attachment section (including end-effector)
Transfer distance of substrate center
635mm (for 300mm wafer)
Z-axis stroke
70mm/140mm
Rotation range
Rotation not limited
Rotation diameter
490mm
Transfer accuracy (X,Y)
±0.1mm
Mass
70kg
Vacuum-proof level
10E-6 Pa
He leakage rate
5x10E-9 Pa.㎥/sec He (Base vacuum 5x10E-4 Pa)
Operating temperature
80℃ or less
Materials used in vacuum
Alminum, Stainless steel, AM350 (Bellows), Magnet with Ni plating spec., Fluorine-based O-ring
Motor specifications
Vacuum direct drive motor (Z-axis: Servo motor)
Encoder specifications
ABS
Utility
48V DC (motor drive), 24V DC (communication)
Communication specifications
TCP/IP
Option
Teaching pendant, Power unit (200V AC input)

Product Dimensions (Standard Specifications)

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