PRODUCTSProduct Information

Wafer Handling System:Aligner

RA120-C01

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Product Features

The non-contact optical detection method detects the center and notch position of the wafer on the spindle. Centering and notch orientation are performed on the robot finger using this aligner and robot.

  • Wafer alignment is performed together with the robot arm operation.
  • Compact structure with the spindle axis only.
  • RORZE original infrared sensor detects a wafer.

Main Specifications of the Product

Wafer size
300mm
Notch angle accuracy
Determined by the alignment performance (positioning accuracy and alignment time interval), the robot performance to be combined, and robot control software.
Center accuracy
Determined by the alignment performance (positioning accuracy and alignment time interval), the robot performance to be combined, and robot control software.
Positioning time interval
Determined by the alignment performance (positioning accuracy and alignment time interval), the robot performance to be combined, and robot control software.
Power supply
24V DC ±10% 3A
Communication method
TCP/IP

Product Dimensions

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